What equipment/techniques are required to build production quality boards with BGA parts?
We have 20-40 boards to build with one 32-Lead Ceramic Ball Grid Array part per board.
BGA Requirements
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Please be positive and constructive with your questions and comments.
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Re: BGA Requirements
well what failures are you seeing?
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Re: BGA Requirements
Since each part is over $25, I'd like to have zero failures.
What kind of failures should we expect if we hand place the parts using a microscope with a tacky flux?
With the rest of our board we have been getting 95+% good parts with solder paste, reflow and a touch of hand rework now and again.
What kind of failures should we expect if we hand place the parts using a microscope with a tacky flux?
With the rest of our board we have been getting 95+% good parts with solder paste, reflow and a touch of hand rework now and again.
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Re: BGA Requirements
it really depends completely on how good you are with hand placement. you're probably going to have to bite it and just try placing a few.
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Re: BGA Requirements
Practicality depends on the pitch, but you need to have a good quality paste print (stainless stencil, inspect every one with a microscope ), and accurate placement, straight-down with no sideways wobble splurging the paste across pads- you may need some mechanical aid for this.
Also probably worth putting alignment marks on the copper layer (not silkscreen as alignment can be poor)
Also probably worth putting alignment marks on the copper layer (not silkscreen as alignment can be poor)
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Re: BGA Requirements
Sounds like Analog's gyros.
Good luck.
Good luck.
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Re: BGA Requirements
I can now report that it is possible to hand place BGA parts if you use a stencil to apply solder paste. I'm not convinced you can do it without a stencil.
We have managed to achieve a 100% success rate with a sample set of two boards.
If anyone is interested I can post a photo of our stencil setup.
Does anyone have a good technique for low volume underfill for BGA parts?
We have managed to achieve a 100% success rate with a sample set of two boards.
If anyone is interested I can post a photo of our stencil setup.
Does anyone have a good technique for low volume underfill for BGA parts?
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Re: BGA Requirements
Please post the stencil setup
thanks!
Rochey
thanks!
Rochey
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Re: BGA Requirements
The jig is a bunch of 'scrap' boards blue taped down to an anti-static mat with a bluetape hinge to hold the stencil in place.
The stencil alignment was checked with a microscope. This is probably the easiest solution that provides the minimum quality required.
The stencil alignment was checked with a microscope. This is probably the easiest solution that provides the minimum quality required.
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- Joined: Sun Aug 28, 2011 4:36 pm
Re: BGA Requirements
Has anyone reballed a BGA component?
Tips or tricks?
Tips or tricks?
Please be positive and constructive with your questions and comments.